Before beginning the Step and Flash Imprint Lithography process, the imprint template is first oriented so that it is substantially parallel and level relative to the underlying wafer. This levelling process is done by the template and wafer levelling sub-systems built into the S-FIL™ imprint tools. The S-FILTM process has been optimised for imprinting on a pre-planarised substrate. Using an ordinary spin-coater, this standard organic planarisation layer is deposited onto the substrate prior to imprinting and enables patterning on a wide range of semiconductor device layers and varying surface topographies, including metals and poly-silicon. In the presence of significant topography, an imprint planarisation step may be used.
 |