| | The Ultimate New Fab Tool
- Unique 4 nm ultra-high resolution FIB and electron optics enable unparalleled process monitoring and root cause defect identification
- Simultaneous in-process FIB cross-sectioning and SEM imaging allows for highly precise and convenient end point detection during FIB milling and TEM sample preparation
- Newly designed ion optics offers high beam currrent for double throughput and substantially increased productivity
- FOUP wafer handling allows preparation of TEM samples while keeping the wafer in its clean environment, which delivers most convenient sample handling
 Essential Specification
Contact
Carl Zeiss NTS GmbH, Oberkochen
Phone: +49 7364 20 4488
Fax: +49 7364 20 4343
 Inquiry
 info-nts@smt.zeiss.com
 www.smt.zeiss.com/nts |