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 | |  CrossBeam® Concept |
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Key components of the AURIGA® CrossBeam®:
GEMINI® electron optical column (center), focused ion beam (left) and gas injection system (right). |
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Fast and precise sample modification
The ever increasing requirements on sample throughput and precision of milled objects are met by integrating the most innovative focused ion beam technology. High brightness liquid metal ion sources combined with state-of-the-art electrostatic lens design deliver an excellent imaging resolution combined with high current ion beam densities and up to 50 nA total beam current.
Deposition of conducting or non-conducting materials, as well as enhanced and selective etching, can be performed with either the electron or ion beam when combined with the highly flexible gas injection technology.
Instrument usage can be optimized based on the "on-board" automation tool set that is easily adapted to specific customer requirements using straight-forward setup wizards and an intuitive scripting language.
High resolution process control
High resolution live electron imaging for excellent site specific control of the milling process is based on an advanced optical design that provides a practically magnetic field-free sample environment. Consequently, a change in the settings of the electron optical system will not interfere at all with the FIB processing; even more importantly there will be no compromises in terms of SEM resolution or ease-of-use of operation while monitoring and controlling the ion beam processing in real time.
Flexible imaging
Topographical and compositional sample information are conveyed simultaneously by high resolution scanning electron imaging of secondary and backscattered electrons. Structural and material information on crystalline samples or oxidation layers can be obtained when operating in FIB imaging mode and detecting secondary ions generated during ion beam scanning of the specimen. | |
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