Enabling the Nano-Age World Semiconductor Metrology Systems
Publications
In the area of Photomask Technologies
Carl Zeiss SMS is pleased to share with you the following list of recent technical publications that give you detailed information on our advanced mask products.

PUBLICATIONS 2011
European Mask and Lithography Conference (EMLC) 2011
The evolution of pattern placement metrology for mask making



PUBLICATIONS 2010
SPIE / BACUS Photomask Conference 2010
Improving registration metrology by correlation methods based on alias-free image simulation
Impact of New MoSi Mask Compositions on Processing and Repair
Process Window improvement on 45 nm technology Non Volatile Memory by CD uniformity improvement Carl Zeiss SMS Germany / Israel, Numonyx, Italy
EUV mask stack optimization for enhanced imaging performance ASML Netherlands / Belgium, Carl Zeiss SMS Jena

Photomask Japan Conference 2010
PROVE, the next generation registration metrology tool, status report, Carl Zeiss SMS, SEMATECH, Carl Zeiss SMT AG
Increased Productivity of Repair Verification by Offline Analysis of Aerial Images, DNP Photomask Europe / Italy, Carl Zeiss SMS/ Germany


SPIE Advanced Lithography 2010
Improved CD control for 45/40nm CMOS logic patterning - Anticipation for 32/28nm , ST Microelectronics France, Carl Zeiss SMS Germany /Israel
Reducing the impact of reticle CD-non-uniformity of multiple
structures by dose corrections based on aerial image measurements, Carl Zeiss SMS Germany, ASML Netherlands
CD Uniformity correction on 45 nm technology Non Volatile Memory Carl Zeiss SMS Germany / Israel, DPE Italy, Numonyx Italy
Actinic Review of EUV Masks, Carl Zeiss SMT AG Germany, Carl Zeiss SMS Germany
Intra Field CD Uniformity Correction by Scanner Dose Mapper using Galileo® Mask Transmission Mapping as the CDU Data Source, Globalfoundries Singapore, Carl Zeiss SMS
European Mask & Lithography Conference 2010
E-beam induced EUV photomask repair – a perfect match



PUBLICATIONS 2009
BACUS Photomask Conference 2009
Expanding The Lithography Process Window With CDC Technology

Challenging defect repair techniques for maximizing mask repair yield




Photomask Japan Conference 2009
Semi-Automated Repair Verification of Aerial Images

Phase behavior through pitch and duty cycle and its impact on process, Carl Zeiss SMS/ Germany, IMEC/ Belgium

Calibration strategies for precision stages in state-of-the-art registration metrology




SPIE Advanced Lithography Conference 2009
Investigation of phase distribution using Phame® in-die phase measurements

WLCD: A new System for Wafer Level CD Metrology on Photomasks

Application of Pixel-based Mask Optimization Technique for High Transmission Attenuated PSM
Mentor Graphics Corp., IMEC, Carl Zeiss SMS



European Mask and Lithography Conference EMLC 2009

Monte-Carlo Simulations of Image Analysis for flexible and high resolution in-die metrology

MeRiT repair verification using in-die phase metrology Phame



Publications 2008
SPIE / BACUS Photomask Conference 2008
Advanced process capabilities for e-beam based photomask repair in production environment

AIMS and Resist Simulation

Photomask registration and overlay by means of 193nm optics

Detection of progressive transmission loss due to haze with Galileo mask DUV transmittance mapping based on non imaging optics


Photomask Japan Conference 2008
Wafer Level CD Metrology on Photomasks using Aerial Imaging Technology

Phame® - phase measurements on 45nm node phase shift features

Increasing the Predictability of AIMS Measurements by Coupling to Resist Simulations, Fraunhofer-Institute of Integrated Systems and Device Technology (IISB), Erlangen, Carl Zeiss SMS GmbH, Jena, IMEC, Leuven, Belgium


SPIE Advanced Lithography Conference 2008
Phase metrology on 45-nm node phase-shift mask structures
Intel Mask Operation, Santa Clara / USA, Carl Zeiss SMS, Jena, Germany

The Flash Memory battle: How low can we go?
ASML, Veldhoven, Netherlands, ASML, Santa Clara, USA, Carl Zeiss SMS Jena, Germany

Hyper-NA imaging of 45nm node random CH layouts using inverse lithography IMEC, Leuven, Belgium, Mentor Graphics, Wilsonville, USA, Rochester Institute of Technology, Rochester, USA


European Mask and Lithography Conference 2008
Phame® - high resolution off-axis phase shift measurements on 45nm node features

Characterizing the imaging performance of Flash Memory masks using AIMS, ASML, Netherlands, Carl Zeiss SMS, Germany

High-resolution and high-precision pattern placement metrology for the 45 nm node and beyond



Publications 2007
SPIE/ BACUS Photomask Conference 2007
Laterally resolved off-axis phase measurements on 45nm node production features using Phame
Carl Zeiss SMS/Germany, Intel/USA

Using the AIMS 45-193i for hyper NA imaging applications
IMEC/Belgium, Carl Zeiss SMS/Germany

Mask CD Control (CDC) with ultrafast Laser for improving mask CDU using AIMS as the CD metrology data source
Pixer Corp./Israel, Carl Zeiss SMS/Germany

Performance Comparison of techniques for intra-field CD control imrovement
Quimonda, Pixer Technology Ltd., AMTC

PMJ Photomask Japan Conference 2007
Novel solution for in-die phase control under scanner equivalent optical settings for 45nm node and below
This paper was awarded with the Best Paper Award from PMJ!

Automated aerial image based CD metrology initiated by pattern marking with photomask layout data


SPIE Advanced Lithography Conference 2007
Study of rigorous effects and polarization
on phase-shifting masks through simulations and in-die phase measurements

Phame: a novel phase metrology tool of Carl Zeiss
for in-die phase measurements under scanner relevant optical settings

Pupil plane analysis on AIMS 45-193i
for advanced photomasks


EMLC 2007
Investigation of hyper-NA scanner emulation
for photomask CDU performance

Programmed defects study on masks
for 45nm immersion lithography using the novel AIMS 45-193i



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