The AIMS™ fab 193i system is based on the performance optimized 2nd generation AIMS™ fab 193 platform. It enables emulation of both dry and immersion 193 nm lithography stepper/scanners with numerical apertures up to 0.93 and offers a high level of flexibility. The system can be used in both wafer fabs and mask shops to analyse mask defects, critical features and to verify repair quality.
To address the latest developments in optical lithography, the AIMS™ fab 193i provides a linear polarisation capability in the illumination. Oriented horizontally or vertically to the mask edges polarisation effects of the mask itself can be investigated which is crucial to optimize designs and lithographic settings for upcoming mask designs.
With its high level of automation and increased throughput, the system is also ready for a new class of fully automated measurement applications such as Global CDU Map for investigating CD uniformity across the photomask. |  Download Brochures
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