AIMS™ fab plus: Aerial Imaging for Wafer Fab
The AIMS™ optically emulates and analyses the printability of mask patterns, defect or defects repairs by selecting stepper equivalent optical conditions at 248 nm. It replaces the wafer by a CCD-array which captures the through focus aerial images. The through focus image stacks are then analysed for CD variation, transmission, process windows, etc. High repeatability of measurement results is achieved for reticle qualification and process development with AIMS™ systems.
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The system was created for the wafer fab for the qualification of masks and the optimization of lithography process parameters in wafer mass production. |  Innovative Features
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Aerial Imaging
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