In Mask Shops the CD distribution of structures on masks is normally measured with CD SEM systems.
Smaller structures, the complexity of the layout and the need to meet device performance targets, require more and more an evaluation technique that shows the 3-D CD distribution captured under scanner conditions.
For this purpose the AIMS™ Design for Manufacturing application module has been developed to show the Across Chip Line Width Variation and to examine the influence of different critical structure on the line-width distribution.
The software module for determining CD and NILS values on critical structures is developed together with Mentor Graphics. The Mentor Graphics CMi module selects the critical so called hotspots and the AIMS™ DFM application is
responsible for the through-focus capture of these aerial images with hardware emulation and to perform software analysis on these grabbed stacks.
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The DFM package is the solution for examining critical
patterns before expensive and time consuming wafer
printing. Besides this benefit the DFM package is also a
valuable tool for design and OPC verification as well as for
mask repair verification.
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